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K3567

Part No K3567
Manufacturer Toshiba Semiconductor and Storage
Catalog Electronic Wholesale
Sample
Rohs State rohs
ECAD Module
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Reference Date Code 16+
Reference case TO-220F
Manufacturer Toshiba Semiconductor and Storage
Manufacturer Homepage www.semicon.toshiba.co.jp/eng
Win Source Part Number 753897-K3567
Popularity Low
Supply and Demand Status Balance
Ultra Librarian 3D Model Ultra Librarian K3567 CAD Model

Description

The K3567 is an N-channel power MOSFET manufactured by Toshiba Semiconductor and Storage. It is designed for high-speed switching applications and low on-resistance, contributing to efficient power conversion.

Applications:

  • DC-DC Converters
  • AC Adapters
  • Power Supplies
  • Motor Control Circuits

Features:

  • Low Drain-Source On-Resistance (RDS(on)): Minimizes conduction losses, improving efficiency.
  • High-Speed Switching: Enables efficient operation in high-frequency circuits.
  • Low Gate Charge: Reduces gate drive requirements, simplifying the drive circuit.
  • Avalanche Rated: Offers robustness against voltage transients.
  • RoHS Compliant: Compliant with environmental regulations.

Benefits:

  • Improved Efficiency: Reduces power consumption and heat generation.
  • Enhanced Reliability: Offers stable performance and long lifespan.
  • Simplified Design: Low gate charge simplifies drive circuit design.
  • Compact Size: Suitable for space-constrained applications.

Additional Details:

The K3567 is characterized by its drain-source voltage (VDS), gate-source voltage (VGS), and continuous drain current (ID) ratings. The on-resistance (RDS(on)) is a critical performance parameter. The gate charge (Qg) significantly affects switching speed. Avalanche energy (EAS) indicates its capability to withstand inductive kickback. Thermal resistance (Rth) dictates its heat dissipation capability. For precise electrical characteristics, thermal performance metrics, and safe operating area limits, consult the Toshiba datasheet. The component is typically available in through-hole and surface mount packages; consult the datasheet for specific package details.

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