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TPCC8103,L1Q(CM

Part No TPCC8103,L1Q(CM
Manufacturer Toshiba Semiconductor and Storage
Catalog OEM Parts (T - Z)
Description Trans MOSFET P-CH Si 30V 18A 8-Pin TSON EP Advance T/R
Sample
Rohs State Need to verify
ECAD Module
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RoHS Non-Compliant
Win Source Part Number 1100788-TPCC8103,L1Q(CM
Categories OEM Parts(T-Z)
Manufacturer Toshiba Semiconductor and Storage
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian TPCC8103,L1Q(CM CAD Model

Description

The TPCC8103,L1Q(CM is a power MOSFET manufactured by Toshiba Semiconductor and Storage. This N-channel MOSFET is designed for use in a variety of power management applications, offering low on-resistance and fast switching speeds for improved efficiency.

Applications

  • DC-DC Converters
  • Load Switching
  • Power Management in Portable Devices
  • Motor Control Circuits

Features

  • Low Drain-Source On-Resistance (RDS(on)): Minimizes conduction losses and increases efficiency.
  • High-Speed Switching: Reduces switching losses and enhances overall performance.
  • Logic Level Drive: Allows direct driving by microcontrollers and other logic devices.
  • Small Surface Mount Package: Enables compact designs and efficient heat dissipation.
  • Halogen-Free: Environmentally friendly composition.

Benefits

  • Improved Power Efficiency: Low RDS(on) contributes to higher efficiency in power conversion.
  • Reduced System Size: Small package facilitates compact and space-saving designs.
  • Simplified Driving Circuitry: Logic level compatibility simplifies gate drive design.
  • Enhanced Thermal Performance: Efficient heat dissipation ensures reliable operation.
  • Environmentally Compliant: Halogen-free construction meets environmental requirements.

Additional Details

The TPCC8103,L1Q(CM typically features a drain-source voltage (VDS) rating suitable for various power supply voltages. The gate threshold voltage (VGS(th)) is designed to be compatible with standard logic levels, enabling easy integration into digital control systems. The device's dynamic characteristics, such as gate charge (Qg) and output capacitance (Coss), are optimized for high-speed switching applications. The surface mount package facilitates automated assembly and efficient heat transfer to the PCB.

The 'L1Q(CM' suffix likely refers to a specific packaging configuration for automated assembly and adherence to environmental standards like RoHS. Consult the datasheet for detailed specifications, thermal performance data, and soldering recommendations.

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