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TPCC8107,L1TECVQ(O

Part No TPCC8107,L1TECVQ(O
Manufacturer Toshiba Semiconductor and Storage
Catalog OEM Parts (T - Z)
Sample
Rohs State Need to verify
ECAD Module
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Win Source Part Number 1100791-TPCC8107,L1TECVQ(O
Categories OEM Parts(T-Z)
Manufacturer Toshiba Semiconductor and Storage
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian TPCC8107,L1TECVQ(O CAD Model

Description

The TPCC8107,L1TECVQ(O) is an N-channel power MOSFET from Toshiba Semiconductor and Storage, optimized for high-efficiency power management applications. It is designed with low on-resistance and fast switching capabilities, making it suitable for use in DC-DC converters, load switches, and other power control circuits.

Applications

  • DC-DC Converters
  • Load Switches
  • Power Management Circuits in Portable Electronics
  • Motor Control Systems

Features

  • Low Drain-Source On-Resistance (RDS(on)): Minimizes power losses and improves efficiency.
  • High-Speed Switching: Reduces switching losses and enhances performance in high-frequency applications.
  • Logic Level Drive: Allows direct control from microcontrollers and other logic devices.
  • Small Surface Mount Package: Enables compact designs and efficient thermal dissipation.
  • Halogen-Free: Compliant with environmental standards.

Benefits

  • Improved Power Efficiency: Low RDS(on) reduces conduction losses, leading to higher overall efficiency.
  • Compact System Design: Small package allows for smaller and more space-efficient designs.
  • Simplified Gate Drive Design: Logic level compatibility simplifies the design of gate drive circuits.
  • Enhanced Thermal Performance: Efficient heat dissipation ensures reliable operation under demanding conditions.
  • Environmentally Responsible: Halogen-free construction meets environmental regulations.

Additional Details

The TPCC8107,L1TECVQ(O) is typically characterized by a drain-source voltage rating suitable for common power supply rails. The gate threshold voltage is designed for compatibility with standard logic levels, simplifying integration with digital control systems. The device's dynamic characteristics are optimized for fast switching. The surface mount package is designed for efficient heat transfer to the PCB, improving thermal performance. The specific meaning of the 'L1TECVQ(O)' suffix would be found in the device datasheet, but it likely relates to the specific packaging and/or tape and reel options used for automated assembly, in addition to RoHS compliance.

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