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XCV50-4BVG256C

Part No XCV50-4BVG256C
Manufacturer Xilinx Inc.
Catalog OEM Parts (T - Z)
Sample
Rohs State Need to verify
ECAD Module
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Win Source Part Number 1009338-XCV50-4BVG256C
Categories OEM Parts(T-Z)
Manufacturer Xilinx Inc.
Popularity Low
Supply and Demand Status Shortage
Ultra Librarian 3D Model Ultra Librarian XCV50-4BVG256C CAD Model

Description

The XCV50-4BVG256C is a Field-Programmable Gate Array (FPGA) from the Virtex series manufactured by Xilinx. FPGAs are highly flexible integrated circuits that can be configured by the user to implement custom digital logic functions. They are widely used in prototyping, hardware acceleration, and custom computing applications.

Applications

  • Digital signal processing (DSP)
  • Image processing
  • Telecommunications
  • Networking equipment
  • Industrial control systems
  • Aerospace and defense applications

Features

  • 5976 Logic Cells
  • 256-Pin Fine-Pitch Ball Grid Array (FBGA) Package
  • System-Level Features such as DLLs, SelectIO interfaces, and on-chip RAM
  • Operating Voltage: 3.3V
  • Advanced process technology for high performance and low power consumption
  • In-system programmability

Benefits

  • Flexibility: Can be reconfigured to implement different logic functions.
  • Performance: Provides high-speed execution for demanding applications.
  • Time-to-market: Allows for rapid prototyping and development.
  • Cost-effectiveness: Can reduce development costs compared to custom ASIC designs.
  • Integration: Combines multiple functions into a single chip.

Additional Details

The XCV50-4BVG256C is based on a SRAM technology, meaning its configuration is volatile and must be loaded at power-up. The device is programmed using Hardware Description Languages (HDLs) such as VHDL or Verilog, and the design is then implemented using Xilinx's development tools. The “-4” speed grade indicates a specific performance level. The BVG256 package is a ball grid array package with 256 pins, offering a compact footprint and high pin density. The Virtex family offers a range of features, including embedded multipliers, RAM blocks, and I/O interfaces, which can be customized to meet specific application requirements.

When using the XCV50-4BVG256C, it is important to consider power dissipation, thermal management, and signal integrity. Xilinx provides detailed documentation and design guidelines to assist with these aspects. Proper debugging and verification are crucial to ensure the correct operation of the design.

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