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Same model may have multiple batches, images only for reference.
S1C17M12F101100-250
Same model may have multiple batches, images only for reference.

S1C17M12F101100-250

Part No S1C17M12F101100-250
Manufacturer Epson Electronics America Inc-Semiconductor Div
Catalog Embedded - Microcontrollers
Sample
Rohs State Need to verify
ECAD Module
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Products specifications Report Issue?

Category Integrated Circuits (ICs)>Embedded - Microcontrollers
Mfr Epson Electronics America Inc-Semiconductor Div
Package Tray
Core Processor S1C17
Core Size 16-Bit
Speed 16.8MHz
Connectivity I2C, IrDA, SPI, UART/USART
Peripherals Brown-out Detect/Reset, LED, POR, PWM, WDT
Number of I/O 38
Program Memory Size 16KB (16K x 8)
Program Memory Type FLASH
RAM Size 2K x 8
Supply Voltage - Operating 1.8V ~ 3.6V
Data Converters A/D 8x12b SAR
Oscillator Type External
Temperature Range - Operating -40°C ~ 85°C (TA)
Mounting SMD (SMT)
Package / Case 48-TQFP
Supplier Device Package 48-TQFP (7x7)
Base Product Number S1C17M12
Standard Package 250
ECCN EAR99
HTSUS 8542.31.0001
Win Source Part Number 1264753-S1C17M12F101100-250
Ultra Librarian 3D Model Ultra Librarian S1C17M12F101100-250 CAD Model

Description

The Epson Electronics America Inc-Semiconductor Div S1C17M12F101100-250 is an integrated circuit with a series of S1C17.

  • Series: S1C17
  • Speed: 16.8MHz
  • Core Size: 16-Bit
  • Package: Tray
  • Standard Package: 250
  • Mounting: SMD (SMT)
  • Connectivity: I2C, IrDA, SPI, and UART/USART
  • Peripherals: Brown-out Detect/Reset, LED, POR, PWM, and WDT
  • Program Memory Size: 16KB (16K x 8)
  • Program Memory Type: FLASH

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