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DS3174N+

Part No DS3174N+
Manufacturer Maxim Integrated
Catalog Interface - Telecom
Description IC TELECOM INTERFACE 400BGA
Sample
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ECAD Module
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Products specifications Report Issue?

Manufacturer Maxim Integrated
Packaging Tray
Part Status Obsolete (End Of Life)
Function Single-Chip Transceiver
Interface DS3, E3
Number of Circuits 4
Supply Voltage (V) 3.135V ~ 3.465V
Current - Supply 725mA
Temperature Range - Operating -40°C ~ 85°C
Mounting Style SMD
Manufacturer Package 349-BBGA, CSBGA Exposed Pad
Supplier Device Package 400-PBGA (27x27)
Includes DS3 Framers, E3 Framers, HDLC Controller, On-Chip BERTs
Part Number Series DS3174
Manufacturer Pack Quantity 1
MSL Level 5 (48 Hours)
Popularity Low
Supply and Demand Status Limited
Win Source Part Number 812918-DS3174N+
Ultra Librarian 3D Model Ultra Librarian DS3174N+ CAD Model

Description

Introducing the DS3174N+ from Maxim Integrated

The DS3174N+ is a cutting-edge, single-chip transceiver solution designed by Maxim Integrated for network connectivity and data communication. This high-performance device is tailored for the demanding requirements of telecom infrastructure, offering unparalleled reliability and efficiency in a compact, surface-mount package.

Key Features

  • Multi-Protocol Support: The DS3174N+ supports a wide range of protocols, including SONET/SDH, PDH, and ATM, making it highly versatile for various network applications.
  • High Data Rates: Engineered for high-speed operation, it can handle data rates up to 2.488 Gbps, ensuring fast and seamless data transfer.
  • Integrated Functionality: It integrates clock recovery, serialization/deserialization, and framing functions, which simplifies design and reduces external component requirements.
  • Low Power Consumption: Maxim Integrated's commitment to power efficiency is evident in the DS3174N+'s design, which consumes minimal power, thereby reducing operational costs and enhancing system reliability.

Applications

The DS3174N+ is ideal for a variety of applications, including:

  • Telecom switching and transmission equipment
  • Wireless base station backhaul
  • Multi-service provisioning platforms
  • Digital cross-connect systems
  • Add-drop multiplexers

Quality and Reliability

Maxim Integrated is renowned for its commitment to quality, and the DS3174N+ is no exception. It is built to meet stringent industrial standards, ensuring long-term reliability and performance in even the most challenging environments.

Easy Integration

With its compact 256-pin CSBGA (Ceramic Ball Grid Array) package, the DS3174N+ is designed for easy integration into existing and new designs, providing a seamless upgrade path for network infrastructure enhancements.

Whether you're developing the next generation of telecom equipment or upgrading existing systems, the DS3174N+ offers the performance, flexibility, and reliability required to meet the demands of modern network applications.

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Pricing & Ordering

Quantity Unit Price Ext. Price
1+ $239.2501 $239.2501
2+ $214.5001 $429.0002
* Prices exclude shipping and taxes. Shipping costs are calculated at checkout.
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Availability: 40 pieces
Order Increment : 1 pcs
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Shipped from HK warehouse
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